Overview:
PCB copper plating is a process where copper cations are driven by applied electric field and being reduced at the cathode surface. It¡¯s a metal electrodeposition process that cooperate with liquid phase mass transfer, electrochemical reactions and electrocrystallization. Electroplating system consists of a DC power source, a dimensionally stable anode (DSA), electrolyte and PCB plate that is going to be plated (cathode).
Anodes£º2H
2O¡úO
2¡ü + (4H
+) + 4e
-
Cathode£ºCu2+ + 2e-¡úCu
Jennings Anodes are offered in standard and custom designs to ensure optimum performance:
1. Stable current output ensures uniform plating
2. Greater current capacity brings higher work efficiency
3. Longer service life