Printed Circuit Board Production

Overview:

PCB copper plating is a process where copper cations are driven by applied electric field and being reduced at the cathode surface. It’s a metal electrodeposition process that cooperate with liquid phase mass transfer, electrochemical reactions and electrocrystallization. Electroplating system consists of a DC power source, a dimensionally stable anode (DSA), electrolyte and PCB plate that is going to be plated (cathode). 

Anodes：2H₂O→O₂↑ + (4H⁺) + 4e^-

Cathode：Cu²⁺ + 2e^-→Cu

Jennings Anodes are offered in standard and custom designs to ensure optimum performance:

1. Stable current output ensures uniform plating
2. Greater current capacity brings higher work efficiency
3. Longer service life